Date: 2018
NECOMADA project presents at CPI event, showcasing opportunities in smart packaging
Companies, researchers and network partners discovered the latest developments in IoT enabled technology at CPI’s event in Darlington to showcase the…
Embracing Opportunities in Smart Packaging
26 September 2018
CPI invites you to discover the latest developments and future opportunities in smart packaging. Register now for…
Danish Technological Institute: Printed Electronics Conference
29 - 30 October 2018
At this two day conference, you will meet experts and professionals from the printed electronics industry as…
E-18 Fair
11 - 13 September 2018
The Electronics 2018 Fair is an exciting innovation zone with over 142 exhibitors covering new technologies,…
innoLAE 2019
22 - 23 January 2019
The 5th annual Innovations in Large-Area Electronics Conference is a not-to-be-missed event in the large-area…
FachPack 2018
25 - 27 September 2018
The leading European trade fair for the packaging industry! See innovations for the packaging process chain,…
LOPEC 2019
19 - 21 March 2019
LOPEC is the leading trade fair for printed electronics. It encompasses every facet of this emerging technology,…
Necomada Project Update – August 2018
The Necomada project has made steady progress within the 18months of the project, with project partners working collaboratively to develop not only a novel…
New Ink and Adhesive Formulations to Reduce Cost of Internet of Things
CPI, as part of its Necomada project, has created new ink and adhesive formulations aimed at reducing the cost of future Internet of Things (IoT) devices.…